•Bonding(COB)- Anticorrosion,anti-shock, high stability

•SMT- Solder paste printing, pick & place, reflow (hot air convection), inspection and rework.

•Through-Hole - Wave solder (lead and lead free), inspection, rework, and aqueous cleaning.

•Electro-Mechanical - Final product assembly including the assembly and integration of chassis, power supply, cables and functional test.

•Testing - In-circuit, functional, Quality Assurance testing.

•Solder - Lead-free (SN/Ag/Cu), (SN) and eutectic (Sn63/Pb37), both no-clean and water soluble.

•Prototype - The ability to respond to design changes typical at the prototype and pre-production stages.

•Failure Analysis- X-ray joint evaluation, micro-sectioning.  

•AOI (Automated Optical Inspection) - Unsurpassed defect detection.

•Full Turnkey Capabilities - Purchasing, incoming inspection, secure stock area

Quality Capacities