CAPABILITIES&CAPACITIES
Luthier Technology Co,. Ltd.
Unit A, 9/F,
Silvercorp International Tower,
707-713 Nathan Road, Mongkok,
Kowloon, Hongkong
Tel: +852 9666 9759
Fax: +852 2110 0996
Email:info@luthiertech.com
www.luthiertech.com
Technological Level
Home > Technological Level
| Bonding(COB) | Ultrasonic soldering | |||||||
| Soldering wire diameter: 0.8~1.0mil Al wire; 1.0~2.0mil Au wire | ||||||||
| Soldering speed:125ms/wire | ||||||||
| Max PCB size :203.2x101.6mm(8"x4") | ||||||||
| SMT | Position accuracy: ±50 @ +3 / Chip; ±25 @ +3 / QFP | |||||||
| Components size range:0.2×0.1mm —130×79mm | ||||||||
| Max height:No limit | ||||||||
| Max PCB size:680×500mm | ||||||||
| Min PCB size: No limit | ||||||||
| Thickness range of PCB: 0.16 to 6mm | ||||||||
| Max PCB weight: 3kg | ||||||||
| Wave-Solder | Max width of PCB:450mm | |||||||
| Min width of PCB: free | ||||||||
| Max height: top120mm/bottom 15mm | ||||||||
| Testing | ICT,Probe flying,burn-in,function test,temperature cycling ect. | |||||||
Copyright@2013-1020 LUTHIER Technology Co,. Ltd.